The University of New Mexico

Microelectronic Failure Analysis

ECE 527 (3)
Microelectronic failure analysis process: electrical characterization, package analysis, global and local failure site isolation; photon and thermal emission; electrical, laser, e-beam and mechanical probing; FIB; deprocessing; backside techniques; EOS/ESD; surface material analysis; FA lab management.

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Office of the Registrar

MSC 11 6325
1 University of New Mexico
Albuquerque, NM 87131

Phone: (505) 277-8900
Fax: (505) 277-6809